Underfill viscous flow between parallel plates and solder bumps

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 4, 2002, Pages 695-700

  Young, Wen Bin ^a   Yang, Wen Lin ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b National Ping Tung Institute of Commerce   (Taiwan)

Author keywords

Capillary flow; Edge effect; Flip chip; Underfill

Indexed keywords

CAPILLARY FLOW; COMPUTER SIMULATION; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; VISCOUS FLOW;

SOLDER BUMPS;

FLIP CHIP DEVICES;

EID: 0037004425     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.806176     Document Type: Conference Paper

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