Capillary-driven underfill encapsulation process

Advanced Packaging

Volumn 8, Issue 4, 1999, Pages

  Gordon, M H ^a   Ni, G ^a   Schmidt, W F ^a   Selvam, R P ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; COMPUTER SIMULATION; ENCAPSULATION; FLIP CHIP DEVICES; MATHEMATICAL MODELS; SOLDERING;

CAPILLARY-DRIVEN UNDERFILL ENCAPSULATION PROCESS; HELE-SHAW APPROXIMATION; SOFTWARE PACKAGE FLUENT;

ELECTRONICS PACKAGING;

EID: 17444435653     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (4)