Electrothermal engineering in the nanometer era: From devices and interconnects to circuits and systems

Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Volumn 2006, Issue , 2006, Pages 223-230

  Banerjee, Kaustav ^a   Lin, Sheng Chih ^a   Srivastava, Navin ^a  

^a Santa Barbara   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP COOLING; CHIP LEAKAGE ESTIMATION; INTEGRATED NETWORKS; POWER DISSIPATION;

CMOS INTEGRATED CIRCUITS; ELECTRIC FREQUENCY CONTROL; ELECTRIC POTENTIAL; INTERCONNECTION NETWORKS; LEAKAGE CURRENTS; OPTIMIZATION; SEMICONDUCTOR DEVICES; SILICON ON INSULATOR TECHNOLOGY; TEMPERATURE DISTRIBUTION; VLSI CIRCUITS;

MICROPROCESSOR CHIPS;

EID: 33748607434     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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