Sub-continuum thermal simulations of deep sub-micron devices under ESD conditions

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD

Volumn , Issue , 2000, Pages 54-57

  Sverdrup, Per G ^a   Banerjee, Kaustav ^a   Dai, Changhong ^a   Shih, Wei kai ^a   Dutton, Robert W ^a   Goodson, Kenneth E ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CONTINUUM MECHANICS; ELECTRIC DISCHARGES; ELECTROSTATICS; HEAT LOSSES; PHONONS;

BOLTZMANN TRANSPORT EQUATION (BTE); DEEP SUB-MICRON DEVICES; SUB-CONTINUUM THERMAL SIMULATIONS;

INTEGRATED CIRCUITS;

EID: 0033710863     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)