Thermal placement algorithm based on heat conduction analogy

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 2, 2003, Pages 473-482

  Lee, Jing ^a  

^a SOUTHERN TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

MCM; Physical design; Reliability; Thermal placement

Indexed keywords

ALGORITHMS; HEAT CONDUCTION; MICROELECTRONIC PROCESSING; MULTICHIP MODULES; PRINTED CIRCUIT BOARDS; RELIABILITY;

MICROELECTRONICS PACKAGING; THERMAL PLACEMENT ALGORITHM;

ELECTRONICS PACKAGING;

EID: 0041384477     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.815091     Document Type: Article

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