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Volumn 41, Issue 5, 2004, Pages 30-35
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Beat the heat
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Author keywords
[No Author keywords available]
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Indexed keywords
COOLING;
ELECTRIC FIELDS;
ELECTROMIGRATION;
ELECTRONICS INDUSTRY;
ELECTRONICS PACKAGING;
HEAT SINKS;
INTEGRATED CIRCUIT LAYOUT;
LAPTOP COMPUTERS;
REFRIGERATION;
SOLDERING ALLOYS;
SUPERCOMPUTERS;
TRANSISTORS;
CHILLED-WATER COOLING;
COMPUTER DESIGNERS;
MECHANICAL STRESS;
PERIPHERAL COMPONENT INTERCONNECT CARDS;
MICROPROCESSOR CHIPS;
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EID: 2442526254
PISSN: 00189235
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (14)
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References (0)
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