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Volumn 14, Issue 4, 2006, Pages 607-615
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Effects of stress and temperature gradients on the evolution of void in metal interconnects driven by electric current and mechanical stress
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPRESSIVE STRESS;
COMPUTER SIMULATION;
CRYSTAL DEFECTS;
ELECTRIC CURRENTS;
ELECTROMIGRATION;
INTERDIFFUSION (SOLIDS);
MECHANICAL STRESS;
STRESS GRADIENT;
TEMPERATURE GRADIENT;
STRESS ANALYSIS;
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EID: 33744751144
PISSN: 09650393
EISSN: 1361651X
Source Type: Journal
DOI: 10.1088/0965-0393/14/4/005 Document Type: Article |
Times cited : (24)
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References (58)
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