Analysis of failure mechanisms in the interconnect lines of microelectronic circuits

Fatigue and Fracture of Engineering Materials and Structures

Volumn 21, Issue 5, 1998, Pages 611-630

  Bower, A F ^a   Craft, D ^a  

^a Brown University   (United States)

Author keywords

Diffusion; Electromigration; Finite elements; Grain boundary; Surface

Indexed keywords

CREEP; DIFFUSION IN SOLIDS; ELECTROMIGRATION; FINITE ELEMENT METHOD; GRAIN BOUNDARIES; INTEGRATED CIRCUITS; PLASTIC DEFORMATION;

INTERCONNECT LINES; SURFACE DIFFUSION;

FAILURE ANALYSIS;

EID: 0032066505     PISSN: 8756758X     EISSN: None     Source Type: Journal    
DOI: 10.1046/j.1460-2695.1998.00057.x     Document Type: Article

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