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Applied Physics Letters

Volumn 85, Issue 12, 2004, Pages 2214-2216

Electromigration-driven motion of morphologically stable voids in metallic thin films: Universal scaling of migration speed with void size

(3) Cho, Jaeseol a Gungor, M Rauf a Maroudas, Dimitrios a

a University of Massachusetts (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INFINITE-CONDUCTOR DOMAINS; LINEAR REGRESSION; METALLIC INTERCONNECT LINES; METALLIC THIN FILMS;

ANISOTROPY; DIFFUSION; ELECTRIC FIELDS; ELECTROMIGRATION; FREE ENERGY; METALLIC FILMS; SURFACE PHENOMENA;

THIN FILMS;

EID: 7044274252 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.1790037 Document Type: Article

Times cited : (34)

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