Impact of joule heating on scaling of deep sub-micron Cu/low-k interconnects

IEEE Symposium on VLSI Circuits, Digest of Technical Papers

Volumn , Issue , 2002, Pages 38-39

  Chiang, Ting Yen ^a   Shieh, Ben ^a   Saraswat, Krishna C ^a  

^a Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; DIELECTRIC MATERIALS; ELECTROMIGRATION; HEATING; PERMITTIVITY; VLSI CIRCUITS;

JOULE HEATING;

INTERCONNECTION NETWORKS;

EID: 0036048355     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)