In situ and real-time tensile testing of thin films using double-field of-view electronic speckle pattern interferometry

Measurement Science and Technology

Volumn 15, Issue 1, 2004, Pages 75-83

  Li, Xide ^a   Yang, Yan ^a   Wei, Cheng ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Deformation; Electronic speckle pattern interferometry; Mechanical properties; Tensile testing; Thin films

Indexed keywords

DEFLECTION (STRUCTURES); DEFORMATION; INTERFEROMETRY; PERFORMANCE; TENSILE TESTING; THICKNESS MEASUREMENT;

ELECTRONIC SPECKLE INTERFEROMETRY; SPRING BEAM DEFLECTION;

THIN FILMS;

TENSILE STRENGTH;

EID: 0842291565     PISSN: 09570233     EISSN: None     Source Type: Journal    
DOI: 10.1088/0957-0233/15/1/011     Document Type: Article

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