Characterization of mechanical and thermal properties of thin Cu foils and wires

Sensors and Actuators, A: Physical

Volumn 99, Issue 1-2, 2002, Pages 172-182

  Weiss, B ^a,c   Groger V ^a   Khatibi, G ^a   Kotas, A ^a   Zimprich, P ^a   Stickler, R ^a   Zagar, B ^b  

^a UNIVERSITY OF VIENNA   (Austria)

^b JOHANNES KEPLER UNIVERSITY LINZ   (Austria)

^c University of Linz Altenbergerstr 69 ^*  (Austria)

Author keywords

Fatigue; Laser speckle strain sensor; Microwires; Size effect; Tensile properties; Thermal expansion values; Thin foils

Indexed keywords

MICROWIRES;

COPPER; DEFORMATION; DILATOMETERS; ELASTIC MODULI; FATIGUE OF MATERIALS; METAL FOIL; OPTICAL SENSORS; STRAIN MEASUREMENT; STRESS ANALYSIS; TENSILE TESTING; THERMAL EXPANSION; WIRE;

MICROELECTROMECHANICAL DEVICES;

EID: 0037197293     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00877-9     Document Type: Conference Paper

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