Study of the yielding and strain hardening behavior of a copper thin film on a silicon substrate using microbeam bending

Materials Research Society Symposium - Proceedings

Volumn 673, Issue , 2001, Pages

  Florando, Jeffrey N ^a   Nix, William D ^a  

^a Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); COPPER; MATERIALS TESTING; NUMERICAL METHODS; SILICON; STRAIN; STRAIN HARDENING; THERMAL CYCLING; THERMAL EFFECTS; YIELD STRESS;

MICROBEAM BENDING; STREE-STRAIN EQUATIONS; YIELDING;

METALLIC FILMS;

EID: 0035558946     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-673-p1.9     Document Type: Conference Paper

References (9)

1. Materials Reliability in Microelectronic IX
2. Applications of synchrotron radiation techniques to materials science IV