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Volumn 27, Issue 3, 2002, Pages 226-229
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Compatibility challenges for high-κ materials integration into CMOS technology
a a a a a
a
NONE
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Author keywords
Device performance; High dielectric constant materials; High dielectrics; Mobility; Process compatibility; Process integration; Silicon microelectronics
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Indexed keywords
CHEMICAL VAPOR DEPOSITION;
CMOS INTEGRATED CIRCUITS;
DEGRADATION;
INTEGRATION;
INTERFACES (MATERIALS);
MICROSTRUCTURE;
MOLECULAR BEAM EPITAXY;
OXIDATION;
PERMITTIVITY;
SILICA;
ULTRAHIGH VACUUM;
HIGH DIELECTRIC CONSTANT MATERIALS;
PROCESS COMPATIBILITY;
PROCESS INTEGRATION;
SILICON MICROELECTRONICS;
DIELECTRIC MATERIALS;
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EID: 0036501795
PISSN: 08837694
EISSN: None
Source Type: Journal
DOI: 10.1557/mrs2002.76 Document Type: Article |
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Times cited : (41)
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References (23)
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