Reliable peeling of ultrathin die with multineedle ejector

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 4, Issue 9, 2014, Pages 1545-1554

  Liu, Zunxu ^a   Huang, Yong An ^a   Liu, Huimin ^a   Chen, Jiankui ^a   Yin, Zhouping ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Adhesive layer; Chip peeling off; Die cracking stress; Energy release rate (err); Microelectronic packaging; Multineedle ejector

Indexed keywords

CHIP SCALE PACKAGES; CRACKS; EJECTORS (PUMPS); ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FRACTURE MECHANICS; MICROELECTRONICS; NEEDLES;

ADHESIVE LAYERS; ANALYTICAL PREDICTIONS; ASSEMBLY TECHNIQUES; CHIP PEELING-OFF; DIE CRACKING; FLIP-CHIP PACKAGING; INTERCONNECT TECHNOLOGY; MICROELECTRONIC PACKAGING;

DIES;

EID: 85027930564     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2014.2344106     Document Type: Article

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