Analysis of stresses in adhesive joints applicable to IC chips using symbolic manipulation and the numerical method

Journal of Adhesion Science and Technology

Volumn 20, Issue 15, 2006, Pages 1669-1692

  Cheng, Tung Hua ^a   Tseng, Ching Huan ^a   Hung, Ching Hua ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Adhesive joint; Coupled equations; Peel stress; Shear stress; Singular value decomposition; Symbolic manipulation

Indexed keywords

ADHESIVES; BOUNDARY CONDITIONS; INTEGRATED CIRCUITS; NUMERICAL METHODS; SHEAR STRESS; STRENGTH OF MATERIALS; ADHESIVE JOINTS; MATHEMATICAL MODELS;

COUPLED EQUATIONS; PEEL STRESS; SINGULAR VALUE DECOMPOSITION; SYMBOLIC MANIPULATION;

ADHESIVE JOINTS; SINGULAR VALUE DECOMPOSITION;

ADHERENDS; ADHESIVE LAYERS; CONCENTRATED FORCE; COUPLED EQUATION; COUPLED EQUATIONS; GOVERNING EQUATIONS; IC CHIPS; LENGTH RATIO; MAJOR FACTORS; PEEL STRESS; SINGULAR VALUES; SYMBOLIC MANIPULATION;

EID: 33846248411     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856106779024463     Document Type: Article

References (30)

1. M. Goland and E. Reissner, ASME J. Appl. Mech. 11, A17-A27 (1944).
2. D. W. Oplinger, Int. J. Solids Struct. 31, 2565-2587 (1994).
3. W. C. Carpenter, J. Strain Anal 24, 185-187 (1989).
4. I. U. Ojalvo and H. L. Eidinoff, AIAA J. 16, 204-211 (1978).
5. W. C. Carpenter, AIAA J. 18, 250-352 (1980).
6. T. Wah, ASME J. Appl. Mech. 40, 174-181 (1973).
7. W. J. Renton and J. R. Vinson, ASME J. Appl Mech. 44, 101-106 (1977).
8. M. Y. Tsai and J. Morton, Int. J. Solids Struct. 31, 2537-2563 (1994).
9. D. J. Allman, Q. J. Mech. Math. 30, 414-436 (1977).
10. Q. Luo and L. Tong, Int. J. Solids Struct. 41, 6351-6381 (2004).
11. A. Özel, M. Aydin and S. Temiz, J. Adhesion Sci. Technol 18, 313-325 (2004).
12. D. Chen and S. Cheng, ASME J. Appl. Mech. 50, 109-115 (1983).
13. S. Alexandrov and O. Richmond, Int. J. Solids Struct. 37, 669-686 (2000).
14. F. Mortensen and O. T. Thomsen, Composites Sci. Technol. 62, 1011-1031 (2002).
15. E. Suhir, ASME J. Appl. Mech. S3, 657-660 (1986).
16. E. Suhir, ASME J. Appl. Mech. 56, 595-600 (1989).
17. E. Suhir, Int. J. Solids Struct. 37, 2229-2252 (2000).
18. J. N. Rossettos, J. Adhesion Sci. Technol. 17, 115-128 (2003).
19. D. M. Gleich, M. J. L. Van Tooren and A. Beukers, J. Adhesion Sci. Technol. 15, 1247-1259 (2001).
20. P. Qiao and J. Wang, Int. J. Solids Struct. 41, 7423-7444 (2004).
21. Z. Q. Qian and A. R. Akisanya, Eur. J. Mech. A 18, 443-463 (1999).
22. T. Sawa, J. Liu, K. Nakano and J. Tanaka, J, Adhesion Sci. Technol. 14, 43-66 (2000).
23. J. Liu and T. Sawa, J. Adhesion Sci. Technol. 14, 67-92 (2000).
24. J. Lee and H. Kim, J. Adhesion 81, 443-472 (2005).
25. A. Li, T. Assih and Y. Delmas, J. Adhesion Sci. Technol. 14, 1639-1656 (2000).
26. B. Taljsten, J. Mater. Civil Eng. 9, 206-212 (1977).
27. R. W. Cornell, ASME J. Appl. Mech. 20, 355-364 (1953).
28. G. P. Zou, K. Shahin and F. Taheri, Composite Struct. 65, 499-510 (2004).
29. W. H. Press, S. A. Teukolsky, W. T. Vetterling and P. F. Brian, Numerical Recipes in C, second edition, pp. 59-70. Cambridge University Press, Cambridge (1992).
30. L. Tong and G. P. Steven, Analysis and Design of Structural Bonded Joints. Kluwer Academic Publishers, Dordrecht (1999).