Static analysis of the die picking process

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 28, Issue 2, 2005, Pages 142-149

  Lin, Yeong Jyh ^a   Hwang, Sheng Jye ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Die bonder; Finite element method; Pickup process; Taguchi method

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); BOUNDARY CONDITIONS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; PEELING; TAPES;

DIE BONDER; PICKUP PROCESS; TAGUCHI METHOD;

SEMICONDUCTING GALLIUM ARSENIDE;

EID: 21244436074     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.847396     Document Type: Article

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