Cohesive failure analysis of an array of IC chips bonded to a stretched substrate

International Journal of Solids and Structures

Volumn 50, Issue 22-23, 2013, Pages 3528-3538

  Liu, Zunxu ^a   Valvo, Paolo S ^b   Huang, Yongan ^a   Yin, Zhouping ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b UNIVERSITY OF PISA   (Italy)

Author keywords

Adhesive layer; Adhesive stresses; Debonding analysis; Energy release rate; Fracture mechanics

Indexed keywords

ADHESIVE LAYERS; ADHESIVE STRESS; ANALYTICAL PREDICTIONS; ELASTIC INTERFACES; GEOMETRICAL DIMENSIONS; INTEGRATED CIRCUIT CHIPS; INTEGRATION CONSTANTS; LAYERED STRUCTURES;

ADHESIVES; CRACKS; DEBONDING; ENERGY RELEASE RATE; FRACTURE MECHANICS; SUBSTRATES;

INTERFACES (MATERIALS);

EID: 84883204653     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2013.06.021     Document Type: Article

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