Competing fracture modeling of thin chip pick-up process

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 7, 2012, Pages 1217-1225

  Peng, Bo ^a   Huang, Yongan ^a   Yin, Zhouping ^a   Xiong, Youlun ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Chip cracking; chip on substrate; competing fracture; interfacial peeling; pick up process; virtual crack closure technique

Indexed keywords

ADVANCED PACKAGING; CHIP GEOMETRY; CHIP SIZES; CHIP-ON-SUBSTRATE; COMPETING MECHANISMS; CONCENTRATED LOAD; CRITICAL SIZE; CRITICAL THICKNESS; CRITICAL VALUE; DUMMY NODES; ELECTRONIC ASSEMBLIES; FRACTURE BEHAVIOR; FRACTURE MECHANISMS; FRACTURE MODELING; IC CHIPS; INTEGRAL STRUCTURES; NEW DESIGN; SUCCESS RATIO; THIN CHIPS; VIRTUAL CRACK-CLOSURE TECHNIQUE;

FRACTURE; PACKAGING; PICKUPS;

STRUCTURAL DESIGN;

EID: 84863779281     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2197859     Document Type: Article

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