Thin die bonding techniques

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 29, Issue , 2004, Pages 68-73

  Medding, Jonathan ^a   Stalder, Roland ^a   Niederhauser, Marcel ^a   Stoessel, Patrick ^a  

^a Oerlikon Assembly Equipment AG   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DEFORMATION; EPOXY RESINS; METAL FOIL; MICROPROCESSOR CHIPS; PEELING;

HIGH-SPEED VIDEO SHOWS; ROBUST PEELING PROCESSES; VISION SYSTEMS;

SOLDERING;

EID: 4644292602     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. Matthias Krieger, Dieter Vischer "Understanding the Epoxy Bond Process", Proceedings of SEMICON Singapore 1997