Tunable peeling technique and mechanism of thin chip from compliant adhesive tapes

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 4, Issue 4, 2014, Pages 560-568

  Liu, Zunxu ^a   Huang, Yongan ^a   Chen, Jiankui ^a   Yin, Zhouping ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Adhesive stresses; energy release rate (ERR); microelectronic fabrication packaging; pick up process; tunable peeling

Indexed keywords

COMPLIANT MECHANISMS; MICROELECTRONICS; PICKUPS;

ADHESIVE STRESS; GEOMETRICAL DIMENSIONS; INTEGRATED CIRCUIT CHIPS; MICROELECTRONIC FABRICATION; MICROELECTRONIC PACKAGING; MIXED BOUNDARY CONDITION; PICK-UP PROCESS; SYSTEM OF LINEAR EQUATIONS;

CHIP SCALE PACKAGES;

EID: 84897572406     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2014.2298036     Document Type: Article

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