A general solution for the two-dimensional stress analysis of balanced and unbalanced adhesively bonded joints

International Journal of Adhesion and Adhesives

Volumn 54, Issue , 2014, Pages 112-123

  Liu, Zunxu ^a   Huang, Yongan ^a   Yin, Zhouping ^a   Bennati, Stefano ^b   Valvo, Paolo S ^b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b UNIVERSITY OF PISA   (Italy)

Author keywords

Adhesively bonded joints; Analytical solution; Single lap joint; Single strap joint; Stiffened plate joint; Stress analysis

Indexed keywords

ADHESIVE JOINTS; ELECTRONICS PACKAGING; LAMINATED COMPOSITES; MATHEMATICAL TECHNIQUES; STRESS ANALYSIS;

ADHESIVELY BONDED JOINTS; ANALYTICAL PREDICTIONS; DISPLACEMENT BOUNDARY CONDITIONS; GEOMETRICAL DIMENSIONS; INTEGRATION CONSTANTS; SINGLE LAP JOINTS; STIFFENED PLATE; TWO-DIMENSIONAL STRESS;

LOADING;

EID: 84902353191     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2014.05.011     Document Type: Article

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