Compensation of externally applied mechanical stress by stacking of ultrathin chips

Solid-State Electronics

Volumn 74, Issue , 2012, Pages 102-107

  Endler, Stefan ^a   Rempp, Horst ^a   Harendt, Christine ^a   Burghartz, Joachim N ^a  

^a Institut fur Mikroelektronik Stuttgart   (Germany)

Author keywords

Flexible electronics; Mechanical stability; Stacked chips; Stress compensation; Ultrathin chips

Indexed keywords

ACTIVE LAYER; ADHESIVE LAYERS; APPLIED MECHANICAL STRESS; CMOS CHIPS; CMOS DEVICES; FLEXIBLE SYSTEM; GLUE LAYERS; LAYER THICKNESS; MECHANICAL BENDING; MECHANICAL STRESS; NEUTRAL LINE; OPTIMUM THICKNESS; SILICON CHIP; SINGLE-CHIP; STACKED CHIPS; STRESS COMPENSATION; ULTRA-THIN CHIPS; VISCOELASTIC BEHAVIOUR;

CMOS INTEGRATED CIRCUITS; FLEXIBLE ELECTRONICS; GLUES; GLUING; MECHANICAL STABILITY;

STRESSES;

EID: 84861907240     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sse.2012.04.019     Document Type: Conference Paper

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