Study in IC chip failure during pick-up process by using experimental and finite element methods

Journal of Materials Processing Technology

Volumn 172, Issue 3, 2006, Pages 407-416

  Cheng, Tung Hua ^a   Du, Chen Chung ^a   Tseng, Ching Huan ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Adhesive; FEM; IC chips; Pick up; Success rate

Indexed keywords

ADHESIVES; COMPUTATIONAL METHODS; FINITE ELEMENT METHOD; MECHANICAL PROPERTIES;

ADHESIVE; PICK-UP; SUCCESS RATE;

INTEGRATED CIRCUITS;

EID: 33344454394     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2005.11.002     Document Type: Article

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