Simulation and analysis for typical package assembly manufacture

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Volumn 2006, Issue , 2006, Pages

  Yong, Liu ^a   Irving, Scott ^a   Desbiens, Don ^a   Luk, Timwah ^a   Qiuxiao, Qian ^b  

^a FAIRCHILD SEMICONDUCTOR   (United States)

^b Fairchild Semiconductor Suzhou Corp   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONIC EQUIPMENT MANUFACTURE; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; RELIABILITY THEORY; SEMICONDUCTOR MATERIALS;

PACKAGE ASSEMBLY MANUFACTURE; PACKAGE CRACKING; PACKAGE DESIGNS; SEMICONDUCTOR PRODUCTS;

ELECTRONICS PACKAGING;

EID: 33847097475     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1643949     Document Type: Conference Paper

References (11)

1. Reiche, M. and Wagner, G., "Wafer Thinning: Techniques for Ultra-thin Wafers," Advanced Packaging, March2003.
2. Peter B and Domenico T, "The back-end process: Step 4-Die attach Today's challenges" Advanced Packaging, April2002.
3. ANSYS9.0 Theory manual,2004
4. Yong Liu and Scott Irving, "Impact of the Die Attach Process on Power & Thermal Cycling For a Discrete Style Semiconductor Package", EuroSimE, 2004.
5. Joseph Alison King, "Material Handbook for Hybrid Microelectronics"
6. Yong Liu and Scott Irving, "Thermosonic Wire Bonding Simulation and Bond Pad Over Active Stress Analysis" Proceedings of 54 th Electronic Components and Technology Conference, 2004.
7. Hess, K.J., Downey, S.H., and Hall, G. B, et al, "Reliability of Bond Over Active Pad Structures for 0.13-um CMOS Technology", Proceedings of 53 th Electronic Components and Technology Conference, New Orleans, May2003.
8. Harman, G., "Wire Bonding Microelectronics Materials, Processes, Reliability, Yield", McGraw-Hill, 1997
9. Mayer, M., Paul, O., Bolliger, D. and Baltes, H., "Integrated Temperature Microsensores for Characterization and Optimization of Thermosonic Ball Bonding Process", Proceedings of 49 th Electronic Components and Technology Conference, San Diego, California, May 1999, pp463-468.
10. Yong Liu, "Curing Stress Analysis of Molding Compound/Epoxy Material with Time Dependent Viscoelastic Properties", Jan.2003
11. Scott Irving, Yong Liu, "An Effective Method for Improving IC Package Die Failure during Assembly Punch Process", EuroSimE, 2005.