Recent progress of atomic layer deposition on polymeric materials

Materials Science and Engineering C

Volumn 70, Issue , 2017, Pages 1182-1191

  Guo, Hong Chen ^a   Ye, Enyi ^a   Li, Zibiao ^a   Han, Ming Yong ^a   Loh, Xian Jun ^a,b,c  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^c SINGAPORE EYE RESEARCH INSTITUTE   (Singapore)

Author keywords

Atomic layer deposition; Inorganic polymer interfaces; Polymeric materials; Surface chemistry; Thin films

Indexed keywords

ATOMS; FILMS; INTERFACES (MATERIALS); POLYMERS; SURFACE CHEMISTRY; SURFACE REACTIONS; SURFACE TREATMENT; THIN FILMS;

APPLICATION AREA; DEPOSITION CONDITIONS; INORGANIC/ORGANIC; INTERNAL STRUCTURE; ITS APPLICATIONS; POLYMER FUNCTIONAL GROUPS; REACTION MECHANISM; SURFACE FUNCTIONAL GROUPS;

ATOMIC LAYER DEPOSITION;

POLYMER;

CHEMISTRY; ELECTRICITY; MATERIALS TESTING; PROCEDURES; SURFACE PROPERTY; THEORETICAL MODEL;

ELECTRICITY; MATERIALS TESTING; MODELS, THEORETICAL; POLYMERS; SURFACE PROPERTIES;

EID: 84958568310     PISSN: 09284931     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msec.2016.01.093     Document Type: Article

References (92)

1. [1] Thoniyot, P., Tan, M.J., Karim, A.A., Young, D.J., Loh, X.J., Adv. Sci., 2, 2015, 1400010.
2. [2] Ye, E., Loh, X.J., Aust. J. Chem. 66 (2013), 997–1007.
3. [3] Bohr, M., Chau, R.S., Ghani, T., Mistry, K., IEEE Spectr. 44 (2007), 23–29.
4. [4] Mistry, K., Allen, C., Auth, C., Beattie, B., Bergstrom, D., Bost, M., Brazier, M., Buehler, M., Cappellani, A., Chau, R., Meeting, Electron Devices, IEDM 2007. IEEE International, 2007, 2007, IEEE, 247–250.
5. [5] Seidel, T., Atomic Layer Deposition, 14-1. Doering, R, Nishi, Y., (eds.) Handbook of Semiconductor Manufacturing Technology, 2008, CRC Press, Florida.
6. [6] T. Suntola, J. Antson, US Patent, 1977.
7. [7] Ritala, M., Leskela, M., Handbook of thin film materials, 1, 2001, 103–159.
8. [8] Fogler, H.S., Elements of chemical reaction engineering. 1999.
9. [9] Eres, G., Sharp, J., J. Appl. Phys. 74 (1993), 7241–7250.
10. [10] Eres, G., Appl. Phys. Lett. 67 (1995), 1727–1729.
11. [11] Park, H.-S., Min, J.-S., Lim, J.-W., Kang, S.-W., Appl. Surf. Sci. 158 (2000), 81–91.
12. [12] Gobbert, M.K., Webster, S.G., Cale, T.S., J. Electrochem. Soc. 149 (2002), G461–G473.
13. [13] Gobbert, M.K., Prasad, V., Cale, T.S., J. Vac. Sci. Technol. B 20 (2002), 1031–1043.
14. [14] Gobbert, M.K., Prasad, V., Cale, T.S., Thin Solid Films 410 (2002), 129–141.
15. [15] Aarik, J., Aidla, A., Kukli, K., Appl. Surf. Sci. 75 (1994), 180–184.
16. [16] Aarik, J., Siimon, H., Appl. Surf. Sci. 81 (1994), 281–287.
17. [17] Ylilammi, M., J. Electrochem. Soc. 142 (1995), 2474–2479.
18. [18] Siimon, H., Aarik, J., J. Phys. IV 5 (1995), 245–252.
19. [19] Peglar, R., Hambleton, F., Hockey, J., J. Catal. 20 (1971), 309–320.
20. [20] Bartram, M., Michalske, T., Rogers, J. Jr., J. Phys. Chem. 95 (1991), 4453–4463.
21. [21] Hakuli, A., Kytökivi, A., Phys. Chem. Chem. Phys. 1 (1999), 1607–1613.
22. [22] Babich, I.V., Plyuto, Y.V., Van Der Voort, P., Vansant, E.F., J. Chem. Soc. Faraday Trans. 93 (1997), 3191–3196.
23. [23] Babich, I.V., Plyuto, Y.V., Van Der Voort, P., Vansant, E.F., J. Colloid Interface Sci. 189 (1997), 144–150.
24. [24] Haukka, S., Lakomaa, E.L., Root, A., J. Phys. Chem. 97 (1993), 5085–5094.
25. [25] Kytökivi, A., Lakomaa, E.-L., Root, A., Österholm, H., Jacobs, J.-P., Brongersma, H.H., Langmuir 13 (1997), 2717–2725.
26. [26] Puurunen, R., Airaksinen, S., Krause, A., J. Catal. 213 (2003), 281–290.
27. [27] Rautiainen, A., Lindblad, M., Backman, L.B., Puurunen, R.L., Phys. Chem. Chem. Phys. 4 (2002), 2466–2472.
28. [28] Puurunen, R., Zeelie, T., Krause, A., Catal. Lett. 83 (2002), 27–32.
29. [29] Lüth, H., Surfaces and Interfaces of Solids. 1993, Springer-Verlag, Berlin, Heidelberg.
30. [30] Horikoshi, Y., Kawashima, M., Yamaguchi, H., Jpn. J. Appl. Phys., 25, 1986, L868.
31. [31] Puurunen, R.L., Chem. Vap. Depos. 10 (2004), 159–170.
32. [32] Ferguson, J., Weimer, A., George, S., Chem. Mater. 16 (2004), 5602–5609.
33. [33] Spagnola, J.C., Gong, B., Parsons, G.N., J. Vac. Sci. Technol. A 28 (2010), 1330–1337.
34. [34] Gong, B., Spagnola, J.C., Parsons, G.N., J. Vac. Sci. Technol. A, 30, 2012, 01A156.
35. [35] Ott, A., Chang, R., Mater. Chem. Phys. 58 (1999), 132–138.
36. [36] Kemell, M., Färm, E., Ritala, M., Leskelä, M., Eur. Polym. J. 44 (2008), 3564–3570.
37. [37] Peng, Q., Sun, X.-Y., Spagnola, J.C., Hyde, G.K., Spontak, R.J., Parsons, G.N., Nano Lett. 7 (2007), 719–722.
38. [38] Gong, B., Parsons, G.N., J. Mater. Chem. 22 (2012), 15672–15682.
39. [39] Park, S.-H.K., Oh, J., Hwang, C.-S., Lee, J.-I., Yang, Y.S., Chu, H.Y., Electrochem. Solid-State Lett. 8 (2005), H21–H23.
40. [40] Hughes, K.J., Engstrom, J.R., J. Vac. Sci. Technol. A, 30, 2012, 01A102.
41. [41] Groner, M., George, S., McLean, R., Carcia, P., Appl. Phys. Lett., 88, 2006, 051907.
42. [42] Cooper, R., Upadhyaya, H.P., Minton, T.K., Berman, M.R., Du, X., George, S.M., Thin Solid Films 516 (2008), 4036–4039.
43. [43] Fabreguette, F.H., George, S.M., Thin Solid Films 515 (2007), 7177–7180.
44. [44] Wilson, C., Grubbs, R., George, S., Chem. Mater. 17 (2005), 5625–5634.
45. [45] Sinha, A., Hess, D.W., Henderson, C.L., J. Vac. Sci. Technol. B 25 (2007), 1721–1728.
46. [46] Kääriäinen, T.O., Cameron, D.C., Tanttari, M., Plasma Process. Polym. 6 (2009), 631–641.
47. [47] Puttaswamy, M., Haugshøj, K.B., Højslet Christensen, L., Kingshott, P., Chem.-A Eur. J. 16 (2010), 13925–13929.
48. [48] Li, Z., Loh, X.J., Chem. Soc. Rev. 44 (2015), 2865–2879.
49. [49] Spagnola, J.C., Gong, B., Arvidson, S.A., Jur, J.S., Khan, S.A., Parsons, G.N., J. Mater. Chem. 20 (2010), 4213–4222.
50. [50] Jur, J.S., Spagnola, J.C., Lee, K., Gong, B., Peng, Q., Parsons, G.N., Langmuir 26 (2010), 8239–8244.
51. [51] Vähä-Nissi, M., Kauppi, E., Sahagian, K., Johansson, L.-S., Peresin, M.S., Sievänen, J., Harlin, A., Thin Solid Films 522 (2012), 50–57.
52. [52] Oldham, C.J., Gong, B., Spagnola, J.C., Jur, J.S., Senecal, K.J., Godfrey, T.A., Parsons, G.N., J. Electrochem. Soc. 158 (2011), D549–D556.
53. [53] Sun, Y., Padbury, R.P., Akyildiz, H.I., Goertz, M.P., Palmer, J.A., Jur, J.S., Chem. Vap. Depos. 19 (2013), 134–141.
54. [54] Hyde, G.K., Park, K.J., Stewart, S.M., Hinestroza, J.P., Parsons, G.N., Langmuir 23 (2007), 9844–9849.
55. [55] Hirvikorpi, T., Vähä-Nissi, M., Harlin, A., Karppinen, M., Thin Solid Films 518 (2010), 5463–5466.
56. [56] Kemell, M., Pore, V., Ritala, M., Leskelä, M., Chem. Vap. Depos. 12 (2006), 419–422.
57. [57] Hyde, G.K., Scarel, G., Spagnola, J.C., Peng, Q., Lee, K., Gong, B., Roberts, K.G., Roth, K.M., Hanson, C.A., Devine, C.K., Langmuir 26 (2009), 2550–2558.
58. [58] Lee, K., Jur, J.S., Parsons, G.N., J. Vac. Sci. Technol. A, 30, 2012, 01A163.
59. [59] Kemell, M., Pore, V., Ritala, M., Leskelä, M., Lindén, M., J. Am. Chem. Soc. 127 (2005), 14178–14179.
60. [60] Lee, S.-M., Pippel, E., Gösele, U., Dresbach, C., Qin, Y., Chandran, C.V., Bräuniger, T., Hause, G., Knez, M., Science 324 (2009), 488–492.
61. [61] Lahtinen, K., Johansson, P., Kääriäinen, T., Cameron, D.C., Polym. Eng. Sci. 52 (2012), 1985–1990.
62. [62] Hirvikorpi, T., Vähä-Nissi, M., Vartiainen, J., Penttilä, P., Nikkola, J., Harlin, A., Serimaa, R., Karppinen, M., J. Appl. Polym. Sci. 122 (2011), 2221–2227.
63. [63] Hirvikorpi, T., Vähä-Nissi, M., Harlin, A., Salomäki, M., Areva, S., Korhonen, J.T., Karppinen, M., Appl. Surf. Sci. 257 (2011), 9451–9454.
64. [64] Parsons, G.N., Atanasov, S.E., Dandley, E.C., Devine, C.K., Gong, B., Jur, J.S., Lee, K., Oldham, C.J., Peng, Q., Spagnola, J.C., Coord. Chem. Rev. 257 (2013), 3323–3331.
65. [65] Parsons, G.N., Atomic Layer Deposition on Soft Materials. Atomic Layer Deposition of Nanostructured Materials, 2011, Wiley-VCH Verlag GmbH & Co. KGaA, 271–300.
66. [66] Xu, Y., Musgrave, C.B., Chem. Mater. 16 (2004), 646–653.
67. [67] Hirvikorpi, T., Vähä-Nissi, M., Mustonen, T., Iiskola, E., Karppinen, M., Thin Solid Films 518 (2010), 2654–2658.
68. [68] Hirvikorpi, T., Vähä-Nissi, M., Nikkola, J., Harlin, A., Karppinen, M., Surf. Coat. Technol. 205 (2011), 5088–5092.
69. [69] Hirvikorpi, T., Vähä-Nissi, M., Harlin, A., Marles, J., Miikkulainen, V., Karppinen, M., Appl. Surf. Sci. 257 (2010), 736–740.
70. [70] Mrkić, S., Galić, K., Ivanković, M., J. Plast. Film Sheeting 23 (2007), 239–256.
71. [71] Miller, D.C., Foster, R.R., Zhang, Y., Jen, S.-H., Bertrand, J.A., Lu, Z., Seghete, D., O'Patchen, J.L., Yang, R., Lee, Y.-C., J. Appl. Phys., 105, 2009, 093527.
72. [72] Zhang, Y., Yang, R., George, S.M., Lee, Y.-C., Thin Solid Films 520 (2011), 251–257.
73. [73] Park, S.-H.K., Oh, J., Hwang, C.-S., Lee, J.-I., Yang, Y.S., Chu, H.Y., Kang, K.-Y., ETRI J. 27 (2005), 545–550.
74. [74] Potscavage, W., Yoo, S., Domercq, B., Kippelen, B., Appl. Phys. Lett., 90, 2007, 253511.
75. [75] Ghosh, A., Gerenser, L., Jarman, C., Fornalik, J., Appl. Phys. Lett., 86, 2005, 223503.
76. [76] Carcia, P., McLean, R., Reilly, M., Groner, M., George, S., Appl. Phys. Lett., 89, 2006, 031915.
77. [77] Meyer, J., Görrn, P., Bertram, F., Hamwi, S., Winkler, T., Johannes, H.H., Weimann, T., Hinze, P., Riedl, T., Kowalsky, W., Adv. Mater. 21 (2009), 1845–1849.
78. [78] Dameron, A.A., Davidson, S.D., Burton, B.B., Carcia, P.F., McLean, R.S., George, S.M., J. Phys. Chem. C 112 (2008), 4573–4580.
79. [79] Kim, N., Potscavage, W. Jr., Domercq, B., Kippelen, B., Graham, S., Appl. Phys. Lett., 94, 2009, 163308.
80. [80] Xiao, X., Cao, G., Chen, F., Tang, Y., Liu, X., Xu, W., Appl. Surf. Sci. 349 (2015), 876–879.
81. [81] Hyde, G.K., Scarel, G., Spagnola, J.C., Peng, Q., Lee, K., Gong, B., Roberts, K.G., Roth, K.M., Hanson, C.A., Devine, C.K., Stewart, S.M., Hojo, D., Na, J.-S., Jur, J.S., Parsons, G.N., Langmuir 26 (2010), 2550–2558.
82. [82] Ding, Y., Xu, S., Zhang, Y., Wang, A.C., Wang, M.H., Xiu, Y., Wong, C.P., Wang, Z.L., Nanotechnology, 19, 2008, 355708.
83. [83] Herrmann, C.F., Delrio, F.W., Bright, V.M., George, S.M., J. Micromech. Microeng. 15 (2005), 984–992.
84. [84] Ali, K., Choi, K.-H., Jo, J., Lee, Y.W., Mater. Lett. 136 (2014), 90–94.
85. [85] Ferrari, S., Perissinotti, F., Peron, E., Fumagalli, L., Natali, D., Sampietro, M., Org. Electron. 8 (2007), 407–414.
86. [86] Fumagalli, L., Natali, D., Sampietro, M., Peron, E., Perissinotti, F., Tallarida, G., Ferrari, S., Org. Electron. 9 (2008), 198–208.
87. [87] Wang, X.D., Graugnard, E., King, J.S., Wang, Z.L., Summers, C.J., Nano Lett. 4 (2004), 2223–2226.
88. [88] Shin, H., Jeong, D.K., Lee, J., Sung, M.M., Kim, J., Adv. Mater. 16 (2004), 1197–1200.
89. [89] Wilson, C., McCormick, J., Cavanagh, A., Goldstein, D., Weimer, A., George, S., Thin Solid Films 516 (2008), 6175–6185.
90. [90] Narayan, R.J., Adiga, S.P., Pellin, M.J., Curtiss, L.A., Hryn, A.J., Stafslien, S., Chisholm, B., Shih, C.-C., Shih, C.-M., Lin, S.-J., Philos. Trans. R. Soc. Lond. A Math. Phys. Eng. Sci. 368 (2010), 2033–2064.
91. [91] Puurunen, R.L., Chem. Vap. Depos. 9 (2003), 249–257.
92. [92] Puurunen, R.L., J. Appl. Phys., 97, 2005, 121301.