System integration by advanced electronics packaging

Bio and Nano Packaging Techniques for Electron Devices: Advances in Electronic Device Packaging

Volumn 9783642285226, Issue , 2012, Pages 31-48

  Wolter, Klaus Jürgen ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

SILICON COMPOUNDS;

ADVANCED ELECTRONICS; ASSEMBLY TECHNOLOGY; ELECTRONIC PACKAGE; ELECTRONIC PACKAGING; HETERO SYSTEM INTEGRATIONS; INTERCONNECTION TECHNOLOGY; MORE THAN MOORE; SYSTEM INTEGRATION; SYSTEMS IN PACKAGES; THREE DIMENSIONAL (3D) INTEGRATION;

SYSTEM-IN-PACKAGE;

EID: 84949179460     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-3-642-28522-6_2     Document Type: Chapter

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