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Volumn , Issue , 2009, Pages
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Trends in IC packaging
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Author keywords
3D packaging; Cost reduction; Embedding; Memory integration; Reliability; Sensors MEMS; Thin dies
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Indexed keywords
3D PACKAGING;
BATCH PROCESS;
DESIGN METHOD;
ELECTRICAL PERFORMANCE;
EMBEDDING;
FINE-PITCH FLIP CHIP;
FORM FACTORS;
FUNCTION INTEGRATION;
HETEROGENEOUS INTEGRATION;
HIGH TEMPERATURE;
IC PACKAGE;
IC PACKAGING;
IN-PROCESS;
INTERFACIAL STRENGTH;
IS COSTS;
LARGE FORMAT;
LONG LIFETIME;
LOW COSTS;
LOW-COST PACKAGING;
MATERIAL COST;
MEMORY INTEGRATION;
NEW TECHNOLOGIES;
ON-WAFER;
PACKAGE DEVELOPMENT;
PACKAGE RELIABILITY;
PIN COUNT PACKAGE;
PIN COUNTS;
POWER CONSUMPTION;
RF-ID TAGS;
SILICON-BASED SENSORS;
STACKED DIE;
TECHNOLOGY-BASED;
THROUGH-VIAS;
ULTRA-THIN;
WAFER FAB;
APPROXIMATION THEORY;
AUTOMOBILE ELECTRONIC EQUIPMENT;
AUTOMOBILE PARTS AND EQUIPMENT;
BATCH DATA PROCESSING;
CHIP SCALE PACKAGES;
COST REDUCTION;
DIES;
INTEGRATED CIRCUITS;
MEMS;
MICROELECTROMECHANICAL DEVICES;
MICROELECTRONICS;
POLYCHLORINATED BIPHENYLS;
PRINTED CIRCUITS;
RADIO NAVIGATION;
RELIABILITY;
SENSORS;
SILICON WAFERS;
TECHNOLOGY;
THREE DIMENSIONAL;
WAFER BONDING;
PACKAGING;
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EID: 70449869154
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (9)
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References (0)
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