Nanomaterials for microelectronic and bio-packaging

Nano-Bio- Electronic, Photonic and MEMS Packaging

Volumn , Issue , 2010, Pages 1-17

  Wong, C P ^a   Moon, Kyoung Sik ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Carbon nanotubes interfaces; Electrical and thermal interconnection; Melting point depression; Molecular dynamic simulation; Nano embedded capacitors; Nanocomposites; Nanomaterials; Nanoparticle synthesis; Solar cell packaging

Indexed keywords

EID: 84890196360     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-1-4419-0040-1_1     Document Type: Chapter

References (52)

1. Zhu L.B. and Wong C.P., Well-aligned open-ended carbon nanotube architectures: An approach for device assembly. Nano Lett. 2006; 6: 243.
2. Zhu L.B. andWong C.P., Aligned carbon nanotube stacks by water-assisted selective etching. Nano Lett. 2005; 5: 2641.
3. Jiang H.J., Moon K., and Wong C.P., The preparation of stable metal nanoparticles on carbon nanotubes whose surfaces were modified during production. Carbon 2007; 45: 655.
4. Jiang H.J., Moon K., and Wong C.P., Low temperature carbon nanotube film transfer via conductive polymer composites. Nanotechnology 2007; 18: 125203.
5. Lin W., Xiu Y., Jiang H., Zhang R., Hildreth O., Moon K., and Wong C.P., Self-assembled monolayer-assisted chemical transfer of in situ functionalized carbon nanotubes. J. Am. Chem. Soc. 2008; 30: 9636-9637.
6. Artaki I., Jackson A.M., and Vianco P.T., Evaluation of lead-free solder joints in electronic assemblies. J. Electron. Mater. 1994; 23(8): 757.
7. Hu W.Y., Xiao S.G., Yang J.Y., and Zhang Z., Melting evolution and diffusion behavior of vanadium nanoparticles. Eur. Phys. J. B 2005; 45(4): 547.
8. Pawlow P.Z., The dependency of melting point on the surface energy of a solid body. (Supplement). Phys. Chem. 1909; 65(5): 545.
9. Lai S.L., Guo J.Y., Petrova V., Ramanath G., and Allen L.H., Size-dependent melting properties of small tin particles: nanocalorimetric measurements. Phys. Rev. Lett. 1996; 77(1): 99.
10. Bachels T., Guntherodt H.J., and Schafer R., Melting of isolated tin nanoparticles. Phys. Rev. Lett. 2000; 85(6): 1250.
11. Zhao S.J., Wang S.Q., Cheng D.Y., and Ye H.Q., Three distinctive melting mechanisms in isolated nanoparticles. J. Phys. Chem. B 2001; 105(51): 12857.
12. Li Y., Moon K., and Wong C.P., Electronics without lead. Science 2005; 308(141): 9.
13. Li Y. and Wong C.P., Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications. Mater. Sci. Eng. R Rep. 2006; R51: 1.
14. Li Y., Moon K., and Wong C.P., Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives. J. Electron. Mater. 2005; 34: 266.
15. Li Y., Yim M., andWong C.P., High performance nonconductive film with π-conjugated selfassembled molecular wires for fine pitch interconnect applications. J. Electron. Mater. 2007; 36: 549.
16. Tsukada Y., Surface laminar circuit packaging. Proceedings of the 42nd Electronic Components and Technology Conference, 1992:22.
17. Han B. and Guo Y., J. Electron. Packag. 1995; 117: 185.
18. Lee W., Han I.Y., Yu J., Kim S.J., and Byun K.Y., "Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing techniquex. Thermochim. Acta 2007; 455: 148-155.
19. Ulrich R.K. and Schaper L.W., Integrated Passive Component Technology. IEEE Press, Wiley- Interscience, Hoboken, NJ, 2003.
20. Lu J., Moon K., Xu J., and Wong C.P., Synthesis and dielectric properties of novel high-K polymer composites containing in-situ formed silver nanoparticles for embedded capacitor applications. J. Mater. Chem. 2006; 16(16): 1543.
21. Lu J. and Wong C.P., Tailored dielectric properties of high-k polymer composites via nanoparticle surface modification for embedded passives applications. IEEE Proceedings of the 57th Electronic Components and Technology Conference, Reno, NV, 2007; pp. 1033-1039.
22. Lu J., Moon K., and Wong C.P., Silver/polymer nanocomposite as a high-k polymer matrix for dielectric composites with improved dielectric performance. J. Mater. Chem. 2008; DOI: 10.1039/B807566B.
23. Neinhuis C. and Barthlott W., Characterization and distribution of water-repellent, selfcleaning plant surfaces. Ann. Bot 1997; 79: 667.
24. Barthlott W. and Neinhuis C., The purity of sacred lotus or escape from contamination in biological surfaces. Planta 1997; 202: 1.
25. Neinhuis C., Koch K., and Barthlott W., Movement and regeneration of waxes through plant cuticles. Planta 2001; 213: 427.
26. Bhushan B. and Jung Y.C., Micro- And nanoscale characterization of hydrophobic and hydrophilic leaf surfaces. Nanotechnology 2006; 17: 2758.
27. Cottin-Bizonne C., Barrat J.-L., Bocquet L., and Charlaix E., Low-friction flows of liquid at nanopatterned interfaces. Nat. Mater. 2003; 2: 237.
28. Wang S.T., Feng L., and Jiang L., One-step solution-immersion process for the fabrication of stable bionic superhydrophobic surfaces. Adv. Mater. 2006; 18: 767.
29. Chattopadhyay S., Li X., and Bohn P.W., In-plane control of morphology and tunable photoluminescence in porous silicon produced by metal-assisted electroless chemical etching. J. Appl. Phys. 2002; 91: 6134.
30. Campbell P. and Green M.A., Light trapping properties of pyramidally textured surfaces. J. Appl. Phys. 1987; 62: 243.
31. Koynov S., Brandt M.S., and Stutzmann M., Black nonreflecting silicon surfaces for solar cells. Appl. Phys. Lett. 2006; 88: 203107.1-203107.3.
32. Xiu Y., Zhang S., Yelundur V., Rohatgi A., Hess D., and Wong C.P., Superhydrophobic and low light reflectivity silicon surfaces fabricated by hierarchical etching. Langmuir 2008; 24: 10421-10426.
33. Yasuda H., Mitsuishi K., and Mori H., Particle-size dependence of phase stability and amorphouslike phase formation in nanometer-sized Au-Sn alloy particles. Phys. Rev. B 2001; 64: 094101.
34. Lee J. and Mori H., Solid-liquid two-phase structures in isolated nanometer-sized alloy particles. Phys. Rev. B 2004; 70: 144105.
35. Shi F.G., Size dependent thermal vibrations and melting in nanocrystals. J. Mater. Res. 1994; 9: 1307.
36. Koch C.C., Jang J.S.C., and Gross S.S., The melting point depression of tin in mechanically milled tin and germanium powder mixtures. J. Mater. Res. 1989; 4: 557.
37. Zhang M., Yu M., Schiettekatte F., Olson E., Kwan A., Lai S., Wisleder T., Greene J., and Allen L., Size-dependent melting point depression of nanostructures: Nanocalorimetric measurements. Phys. Rev. B 2001; 62: 10548.
38. Zhao M., Zhou X.H., and Jiang Q., Comparison of different models for melting point change of metallic nanocrystals. J. Mater. Res. 2001; 16: 3304.
39. Phillpot S.R., Lutsko J.F., Wolf D., and Yip S., Molecular-dynamics study of lattice-defectnucleated melting in silicon. Phys. Rev. B 1989; 40: 2831.
40. Nguyen T., Ho P.S., Kwok T., Nitta C., and Yip S., Grain-Boundary Melting Transition in an Atomistic Simulation Model. Phys. Rev. Lett. 1986; 57: 1919.
41. Zhao S.J., Wang S.Q., Zhang T.G., and Ye H.Q., A cluster-induced structural disorder and melting transition in grain-boundary of B2 NiAl: A molecular-dynamics simulation on parallel computer. J. Phys. Condens. Matter 2000; 12: L549.
42. Dong H., Zhang Z., and Wong C.P., Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications. J. Adhes. Sci. Technol. 2006; 19(2): 87-94.
43. Dong H., Moon K., and Wong C.P., Molecular dynamics study on coalescence of Cu nanoparticles and their deposition on Cu substrate. J. Electron. Mater. Nov. 2004; 33: 1326-1330.
44. Dong H., Moon K.S., and Wong C.P., Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications. J. Electron. Mater. 2005; 34(1): 40.
45. Dong H., Moon K., Jiang H., Wong C.P., and Hua F., Simulation study of nanoparticle melting behavior for lead free nano solder application. 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, 15-17 March 2006:107.
46. Dong H., Moon K.-S., Jiang H., Baskes M.I., Hua F., and Wong C.P., Computer simulation of nano tin melting behavior: Effect of particle size temperature ramping up rate. American Chemical Society National Meeting & Exposition, March 29, 2006 (Invited).
47. Alavi S., Molecular dynamics simulations of the melting of aluminum nanoparticles. J. Phys. Chem. A 2006; 110(4): 1518-1523.
48. Yang Z., Yang X., and Xu Z., Molecular dynamics simulation of the melting behavior of Pt-Au nanoparticles with core-shell structure. J. Phys. Chem. C 2008; 112(13): 4937-4947.
49. Baskes M.I., Modified embedded-atom potentials for cubic materials and impurities. Phys. Rev. B 1992; 46: 2727.
50. Ravelo R., Aguilar J., and Baskes M.I., Molecular-Dynamics Studies of Thin Films of Sn on Cu. Mater. Res. Soc. Symp. Proc. 1998; 492: 43.
51. Baskes M.I., Determination of modified embedded atom method parameters for nickel. Mater. Chem. Phys. 1997; 50: 152.
52. Hanszen K., Theoretische Untersuchungen über den Schmelzpunkt kleiner Kügelchen. Z. Phys. 1960; 157: 523-553.