Low temperature copper-copper thermocompression bonding

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 399-404

  Ang, X F ^a   Lin, A T ^a   Wei, J ^b   Chen, Z ^a   Wong, C C ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRONICS PACKAGING; SHEAR STRENGTH;

AMBIENT ENVIRONMENTS; BONDING MECHANISMS; BONDING TEMPERATURES; COPPER SURFACES; LOW TEMPERATURES; LOW-TEMPERATURE REGIMES; ROOM TEMPERATURES; THERMO-COMPRESSION BONDINGS;

THERMAL EFFECTS;

EID: 63049131679     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763467     Document Type: Conference Paper

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