Deep Reactive Ion Etching of Through Silicon Vias

Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits

Volumn 1, Issue , 2008, Pages 45-91

  Roozeboom, Fred ^a   Blauw, Michiel A ^b   Lamy, Yann ^a   Grunsven, Eric Van ^c   Dekkers, Wouter ^a   Verhoeven, Jan F ^c   van den Heuvel, Eric F ^c   van der Drift, Emile ^d   Kessels, Erwin W M M ^b   van de Sanden, Richard M C M ^b  

^a NXP TSMC Research Center   (Netherlands)

^b EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

^d DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Deep reactive ion etching (DRIE); Plasma; Via etching

Indexed keywords

EID: 84891289309     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9783527623051.ch4     Document Type: Chapter

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