Thin wafer handling and processing-results achieved and upcoming tasks in the field of 3D and TSV

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2009, Pages 787-789

  Kettner, Paul ^a   Burggraf, Jürgen ^a   Kim, Bioh ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

CARRIER WAFERS; CMOS DEVICES; HIGH YIELD; MECHANICAL SUPPORT; MICROELECTRONIC APPLICATIONS; ON-WAFER; PROCESSING TECHNOLOGIES; THIN WAFERS; THROUGH-SILICON-VIA; ULTRA-THIN; VOLUME MANUFACTURING;

CHIP SCALE PACKAGES; DEBONDING; MECHANICAL STABILITY; MICROELECTRONICS; SEMICONDUCTING SILICON COMPOUNDS; TECHNOLOGY; WAFER BONDING;

SILICON WAFERS;

EID: 77950949972     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2009.5416442     Document Type: Conference Paper

References (8)

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2. Matt Nowak semiconductor.net/article/356905-Qualcomm-s-Nowak-3-D-Faces- Cost 08.10.2009
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4. J.Charbonnier, S.Cheramy, D.Henry, A.Astier, J.Brun, N.Sillon, A.Jouve, S.Fowler, M.Privett, R.Puligadda, J.Burggraf, S.Pargfrieder, "Integration of a Temporary Carrier in a TSV Process Flow", ECTC 2009 - May 26-29, 2009 San Diego
5. th Singapore
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8. st 2009 Tampa, Florida, USA