Application of copper-Carbon Nanotubes composite in packaging interconnects

Proceedings of the International Spring Seminar on Electronics Technology

Volumn , Issue , 2011, Pages 531-536

  Aryasomayajula, Lavanya ^a   Rieske, Ralf ^a   Wolter, Klaus Juergen ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC PACKAGING; FILLER MATERIALS; INTERCONNECT TECHNOLOGY; SOLDER JOINTS;

CARBON NANOTUBES; COPPER; ELECTRONICS PACKAGING;

PACKAGING MATERIALS;

EID: 82955165869     PISSN: 21612528     EISSN: 21612536     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2011.6053943     Document Type: Conference Paper

References (18)

1. M. Heimann, R. Rieske, O. Telychkina, B. Böhme and K. Wolter, "Application of carbon nanotubes as conductive filler of epoxy adhesives in microsystems,"in", 2009, GMM Workshop.
2. M. Heimann, B. Boehme, S. Scheffler, M. Wirts-Ruetters and K. -. Wolter, "CNTs - a comparable study of CNT-filled adhesives with common materials," in Electronic Components and Technology Conference, 2009, pp. 1871-1878.
3. R. Wojciech, "Characterisation of Processability of CNT Filled Lead-Free Solder Pastes" Diplomathesis 2009.
4. Teng Wang, Kjell Jeppson, Niklas Olofsson, Eleanor E B Campbell and Johan Liu, "Through silicon vias filled with planarized carbon nanotube bundles", Nanotechnology,2009, vol. 20.
5. S. Arai, T. Saito, and M. Endo, "Cu-MWCNT Composite Films Fabricated by Electrodeposition", Journal of the Electrochemical Society,2010 vol. 157.
6. S Bal, S S Samal, "Carbon nanotube reinforced polymer composites- A state of the art" Bull. Mater. Sci., 2007, vol. 30, pp. 379.
7. M. Heimann, M. Wirts-Ruetters, B. Boehme and K.J.-Wolter, "Investigations of carbon nanotubes epoxy composites for electronics packaging" Electronic Components and Technology Conference, 2008. pp. 1731-1736.
8. S. M. L. Nai, J. Wei and M. Gupta, "Effect of carbon nanotubes on the shear strength and electrical resistivity of a lead-free solder" J Electron Mater,2008, vol. 37, pp. 515-522.
9. K.M., Begam, M.K., Lai and N.M., Mohamed, "The role of Al2O3 buffer layer in the growth of aligned CNTs" Journal of Advanced Maerials Research,Feb. 2008, Vol. frontiers in Materials Science and Technology, pg. 29-32.
10. Santiago Esconjauregui, Martin Fouquet, Bernhard C. Bayer, Caterina Ducati, Rita Smajda, Stephan Hofmann, and John Robertson, "Growth of Ultrahigh Density Vertically Aligned Carbon Nanotube Forests for Interconnects",2010 ACS Nano, vol. 4, pp. &431.
11. Yang Chai, "Fabrication and Characterization of Carbon Nanotubes for Interconnect Applications", Dissertation, The Hong Kong University of Science and Technology, 2009.
12. Quanfang Chen, "Carbon Nanotube Reinforced Metal Composites", US Patent 2007/0036978A1, Feb15 2007.
13. Susumu Arai, Takashi Saito, and Morinobu Endo, "Effects of Additives on Cu-MWCNT Composite Plating Films" J. Electrochem. Soc., vol. 157, 2010.
14. Tamjid Chowdhury, J. F. Rohan, "Influence of Carbon Nanotubes on the Electrodeposition of Copper Interconnects" ECS Trans. 2010, vol. 25.
15. P. Liu, D. Xu, Z. Li, B. Zhao, E. S. Kong and Y. Zhang, "Fabrication of CNTs/Cu composite thin films for interconnects application" Microelectronic Engineering,2008 vol. 85, pp. 1984-1987, 10.
16. Yang Chai, P. C. H. Chan, Yunyi Fu, Y. C. Chuang and C. Y. Liu, "Copper/carbon nanotube composite interconnect for enhanced electromigration resistance"in Electronic Components and Technology Conference, 2008, pp. 412-420.
17. Menzel SB, Thomas J, Weissker U, Schäffel F, Hossbach C, Albert M, Hampel S, Gemming T., "Preparation of CNT-copper matrix composite films", J Nanosci Nanotechnol.2009, vol. 9, pp. 6096-103.
18. Contract Research Report-"Preparation of a composite consisting of aligned carbon nanotubes and copper", by Fraunhofer IKTS, Dr Ingolf Endler.