Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets

Journal of Alloys and Compounds

Volumn 656, Issue , 2016, Pages 500-509

  Chen, Guang ^a,b   Wu, Fengshun ^a   Liu, Changqing ^b   Silberschmidt, Vadim V ^b   Chan, Y C ^c  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^c CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Lead free solder; Mechanical properties; Melting temperature; Ni coated graphene oxide; Raman spectrum; Wettability

Indexed keywords

COPPER COMPOUNDS; ENERGY DISPERSIVE SPECTROSCOPY; GRAPHENE; INTERFACES (MATERIALS); INTERMETALLICS; LEAD POWDER METALLURGY; MECHANICAL PROPERTIES; MELTING; MELTING POINT; MICROSTRUCTURE; NANOSHEETS; NICKEL; POWDER METALLURGY; RAMAN SCATTERING; REINFORCEMENT; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; SOLDERING ALLOYS; TIN; TIN ALLOYS; WETTING; X RAY SPECTROSCOPY;

CHEMICAL CHARACTERIZATION; CHEMICAL REDUCTION METHODS; COMPOSITE SOLDER JOINTS; ELECTRICAL AND MECHANICAL PROPERTIES; ENERGY DISPERSIVE X RAY SPECTROSCOPY; GRAPHENE OXIDES; MICROSTRUCTURES AND PROPERTIES; SN-AG-CU LEAD-FREE SOLDERS;

LEAD-FREE SOLDERS;

EID: 84943613642     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2015.09.178     Document Type: Article

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