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Journal of Alloys and Compounds

Volumn 581, Issue , 2013, Pages 202-205

Effects of Ni-coated Carbon Nanotubes addition on the electromigration of Sn-Ag-Cu solder joints

(3) Yang, Zhongbao a Zhou, Wei a Wu, Ping a

a TIANJIN UNIVERSITY (China)

Author keywords

Atomic diffusion; Composite materials; Intermetallics

Indexed keywords

CARBON NANOTUBES; COMPOSITE MATERIALS; DIFFUSION IN SOLIDS; ELECTROMIGRATION; FINITE ELEMENT METHOD; INTERMETALLICS; LEAD-FREE SOLDERS; NANOTUBES; NICKEL; SOLDERING; SOLDERING ALLOYS; TIN; YARN;

ATOMIC DIFFUSIONS; CARBON NANOTUBE NETWORK; COMPOSITE SOLDERS; ELECTROMIGRATION ANALYSIS; ELECTROMIGRATION BEHAVIOR; ELECTROMIGRATION RESISTANCE; FINITE ELEMENT SIMULATIONS; SNAGCU SOLDER;

MULTIWALLED CARBON NANOTUBES (MWCN);

EID: 84884225125 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2013.07.058 Document Type: Article

Times cited : (44)

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