Effects of Ni-coated carbon nanotubes addition on the microstructure and mechanical properties of Sn-Ag-Cu solder alloys

Materials Science and Engineering: A

Volumn 590, Issue , 2014, Pages 295-300

  Yang, Zhongbao ^a   Zhou, Wei ^a   Wu, Ping ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

Composite solder; Load transfer; Mechanical properties

Indexed keywords

COPPER ALLOYS; CREEP; CREEP RESISTANCE; FINITE ELEMENT METHOD; LEAD-FREE SOLDERS; MICROSTRUCTURE; REINFORCED PLASTICS; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; TENSILE STRENGTH; TERNARY ALLOYS; TIN ALLOYS; YARN;

COMPOSITE SOLDERS; INTERFACE REACTIONS; LOAD TRANSFER; MICROSTRUCTURES AND MECHANICAL PROPERTIES; NANO INDENTATION; SN-AG-CU SOLDER ALLOYS; SNAGCU SOLDER; SOLDER JOINTS; STRENGTHENING EFFECT; ULTIMATE TENSILE STRENGTH;

CARBON NANOTUBES;

EID: 84887138477     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2013.10.008     Document Type: Article

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