SCOPUS 정보 검색 플랫폼

Thin Solid Films

Volumn 410, Issue 1-2, 2002, Pages 212-221

Solid-liquid interdiffusion bonding between In-coated silver thick films

(4) Lin, Jing Chie a Huang, Long Wei a Jang, Guh Yaw a Lee, Sheng Long a

a NATIONAL CENTRAL UNIVERSITY (Taiwan)

Author keywords

Ag In intermetallic compounds; Indium coat; Silver thick films; Solid liquid interdiffusion bonding

Indexed keywords

BOND STRENGTH (CHEMICAL); BONDING; COATINGS; DEPOSITION; HEATING; INDIUM; INTERMETALLICS; SCANNING ELECTRON MICROSCOPY; SCREEN PRINTING; SILVER; SUBSTRATES; THICK FILMS; X RAY DIFFRACTION ANALYSIS;

INTERDIFFUSION BONDING;

INTERDIFFUSION (SOLIDS);

EID: 0036573714 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6090(02)00240-7 Document Type: Article

Times cited : (42)

References (16)

1
- 0002139798
- (1992) Solder. Surf. Mount. Technol. , vol.10 , pp. 27
- Jacobson, D.M.¹ Humpston, G.²

2
- 24644521295
- (1966) J. Electrochem. Soc. , vol.113 , pp. 1282
- Bernstein, L.¹

3
- 0027608039
- (1993) J. Electronic. Pack. , vol.115 , pp. 201
- Lee, C.C.¹ Wang, C.Y.² Matijasevic, G.³

4
- 0003476808
- Electrochemical Publishers Ltd, Scotland
- (1988) A Scientific Guide to Surface Mount Technology
- Lea, C.¹

5
- 51249170304
- (1994) J. Electron. Mater. , vol.23 , pp. 787
- Bartels, F.¹ Morris J.W. Jr² Dalke, G.³ Gust, W.⁴

6
- 0009394276
- (1992) Solder. Surf. Mount. Technol. , vol.23 , pp. 12
- Jacobson, D.M.¹ Sangha, S.P.S.²

7
- 0001851375
- T.B. Massalski (Ed.), ASM International Material Park, OH
- (1990) Binary Alloy Phase Diagrams , pp. 47
- Baren, M.R.¹

8
- 0003456067
- Wiley-Interscience, New York
- (1972) Thick Film Hybrid Microcircuit Technology , pp. 69
- Hamer, D.W.¹ Biggers, J.V.²

9
- 0009457456
- P.J. Holmes, R.G. Loasby (Eds.), Electrochemical Publishers Ltd, Ayr, Scotland
- (1976) Handbook of Thick Film Technology , pp. 106
- Savage, J.¹

10
- 0030216081
- (1996) Mater. Chem. Phys. , vol.45 , pp. 136
- Lin, J.C.¹ Wang, C.Y.²

11
- 0030242921
- (1996) Mater. Chem. Phys. , vol.45 , pp. 253
- Lin, J.C.¹ Wang, C.Y.²

12
- 0009345235
- (1997) J. Electrochem. Soc. , vol.144 , pp. 165
- Lin, J.-C.¹ Chung, J.-Y.²

13
- 0018507042
- (1979) Thin Solid Films , vol.61 , pp. 149
- Simic, V.¹ Marinkovic, Z.²

14
- 0026116734
- (1991) Thin Solid Films , vol.197 , pp. 303
- Roy, R.¹ Sen, S.K.²

15
- 0003872122
- John Wiley & Sons Inc
- (2000) Materials Science and Engineering, An Introduction,5th ed. , pp. 17
- Callister W.D. Jr¹

16
- 0009394277
- (1997) IEEE Trans. Compon. Pack. Manuf. Technol. , vol.20 , pp. 47
- Chen, Y.C.¹ So, W.W.² Lee, C.C.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.