Fluxless bonding of silicon to Ag-cladded copper using Sn-based alloys

Materials Science and Engineering: A

Volumn 458, Issue 1-2, 2007, Pages 116-122

  Kim, Jong S ^a   Yokozuka, Takehide ^b   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b HITACHI LTD   (Japan)

Author keywords

Ag; Ag Sn alloys; Cu; Electroplating; Fluxless bonding; Fluxless soldering; Sn

Indexed keywords

COPPER; ELECTROPLATING; INTERMETALLICS; METAL CLADDING; METALLOGRAPHIC MICROSTRUCTURE; OXIDATION RESISTANCE; SILICON; SILVER PLATING; SOLDERED JOINTS; SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS;

FLUXLESS BONDING; FLUXLESS SOLDERING; SILVER CLADDING;

SOLDERING;

COPPER; ELECTROPLATING; INTERMETALLICS; METAL CLADDING; METALLOGRAPHIC MICROSTRUCTURE; OXIDATION RESISTANCE; SILICON; SILVER PLATING; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS;

EID: 34147143396     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.12.104     Document Type: Article

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