Fluxless bonding of silicon chips to ceramic packages using electroplated Au/Sn/Au structure

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2007, Pages 41-46

  Wang, Pin J ^a   Kim, Jong S ^a   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CERAMIC MATERIALS; MICROPROCESSOR CHIPS; SUBSTRATES;

ALUMINA SUBSTRATE; VOID-FREE JOINT;

SILICON;

EID: 44449122922     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2007.4419926     Document Type: Conference Paper

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