Kinetics of Ag3Sn growth in Ag-Sn-Ag system during transient liquid phase soldering process

Acta Materialia

Volumn 58, Issue 9, 2010, Pages 3429-3443

  Li, J F ^a   Agyakwa, P A ^a   Johnson, C M ^a  

^a UNIVERSITY OF NOTTINGHAM   (United Kingdom)

Author keywords

Differential scanning calorimetry (DSC); Interface; Intermetallic compounds; Kinetics; Transient liquid phase (TLP) soldering

Indexed keywords

AG ATOMS; CONTROLLED GROWTH; CONTROLLING MECHANISM; INTERFACE; INTERFACE INTERMETALLIC COMPOUNDS; INTERFACIAL REACTIONS; KINETIC CONSTANT; REACTION CONSTANT; SOLDERING PROCESS; THIN LAYERS; TIME DEPENDENCE; TRANSIENT LIQUID PHASE; TRANSIENT LIQUID PHASE (TLP) SOLDERING;

ACTIVATION ENERGY; DIFFERENTIAL SCANNING CALORIMETRY; GRAIN GROWTH; GROWTH KINETICS; LIQUIDS; PHASE INTERFACES; RATE CONSTANTS; REACTION KINETICS; SEMICONDUCTING INTERMETALLICS; SOLDERING; TIN;

SILVER;

EID: 77950073247     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.02.018     Document Type: Article

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