Fluxless eutectic bonding of GaAs-on-Si by using Ag/Sn solder

Electronic Materials Letters

Volumn 9, Issue 6, 2013, Pages 787-791

  Eo, Sung Hwa ^a   Kim, Dae Seon ^a   Jeong, Ho Jung ^a   Jang, Jae Hyung ^a  

^a Gwangju Institute of Science and Technology (GIST)   (South Korea)

Author keywords

Ag Sn solder; Ar plasma treatment; diffusion barrier; eutectic bonding; wafer bonding

Indexed keywords

AR PLASMA TREATMENT; BONDING CONDITIONS; BONDING STRENGTH; EUTECTIC BONDING; FLUXLESS BONDING; HETEROGENEOUS MATERIALS; METAL SURFACES; SHEAR STRENGTH TESTS;

DIFFUSION BARRIERS; DIFFUSION BONDING; GALLIUM ARSENIDE; OPTIMIZATION; PLASMA THEORY; SEMICONDUCTING GALLIUM; SILICON; SILICON WAFERS;

WAFER BONDING;

EID: 84887860406     PISSN: 17388090     EISSN: 20936788     Source Type: Journal    
DOI: 10.1007/s13391-013-6012-8     Document Type: Article

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