Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Journal of Electronic Materials

Volumn 44, Issue 8, 2015, Pages 2898-2907

  Mu, Wei ^a,b   Sun, Shuangxi ^b   Jiang, Di ^b   Fu, Yifeng ^c   Edwards, Michael ^b   Zhang, Yong ^a,b   Jeppson, Kjell ^b   Liu, Johan ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SHT SMART HIGH TECH AB   (Sweden)

Author keywords

Carbon nanotube bundles; polymer filling; postgrowth transfer; resistivity; TSV

Indexed keywords

BONDING; CARBON; ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; FILLING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT INTERCONNECTS; INTEGRATED CIRCUIT MANUFACTURE; POLYMERS; SEMICONDUCTING SILICON; SEMICONDUCTOR GROWTH; SILICON; SILICON WAFERS; THREE DIMENSIONAL INTEGRATED CIRCUITS; YARN;

CARBON NANOTUBE BUNDLE; ELECTRICAL PERFORMANCE; POLYMER FILLING; POSTGROWTH TRANSFER; THROUGH SILICON VIAS; TSV; VERTICALLY ALIGNED CARBON NANOTUBE; VOLTAGE CHARACTERISTICS;

CARBON NANOTUBES;

EID: 84933676008     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-015-3752-2     Document Type: Article

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