Development of carbon nanotube based through-silicon vias

Journal of Nanotechnology in Engineering and Medicine

Volumn 1, Issue 2, 2010, Pages

  Kim, Bruce C ^a   Kannan, Sukeshwar ^a   Gupta, Anurag ^a   Mohammed, Falah ^b   Ahn, Byoungchul ^c  

^a UNIVERSITY OF ALABAMA   (United States)

^b AN NAJAH NATIONAL UNIVERSITY   (Palestine)

^c Yeungnam University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP INTERCONNECTS; CHOICE OF FILLER MATERIALS; DESIGN AND DEVELOPMENT; ELECTRICAL MODELING; FILLER MATERIALS; HIGH RESISTIVITY; INTEGRATED SYSTEMS; THROUGH SILICON VIAS;

CARBON NANOTUBES; COPPER; FILLERS; POLYSILICON; TUNGSTEN;

SINGLE-WALLED CARBON NANOTUBES (SWCN);

EID: 78649944493     PISSN: 19492944     EISSN: 19492952     Source Type: Journal    
DOI: 10.1115/1.4001537     Document Type: Article

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