Well-aligned open-ended carbon nanotube architectures: An approach for device assembly

Nano Letters

Volumn 6, Issue 2, 2006, Pages 243-247

  Zhu, Lingbo ^a   Sun, Yangyang ^a   Hess, Dennis W ^a   Wong, Ching Ping ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AS-ASSEMBLED CNT DEVICES; CNT TRANSFER TECHNOLOGY; ELECTRICAL INTERCONNECTS;

ADHESION; ELECTRONICS PACKAGING; FIELD EMISSION MICROSCOPES; SUBSTRATES; THERMAL EFFECTS;

CARBON NANOTUBES;

CARBON NANOTUBE; LEAD; SILICON; TIN;

ADSORPTION; ARTICLE; CHEMISTRY; METHODOLOGY; PARTICLE SIZE; SCANNING ELECTRON MICROSCOPY; SENSITIVITY AND SPECIFICITY; SURFACE PROPERTY; TEMPERATURE;

ADSORPTION; LEAD; MICROSCOPY, ELECTRON, SCANNING; NANOTUBES, CARBON; PARTICLE SIZE; SENSITIVITY AND SPECIFICITY; SILICON; SURFACE PROPERTIES; TEMPERATURE; TIN;

EID: 33644896599     PISSN: 15306984     EISSN: None     Source Type: Journal    
DOI: 10.1021/nl052183z     Document Type: Article

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