Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction

Journal of Applied Physics

Volumn 104, Issue 1, 2008, Pages

  Chen, Kai ^a,b   Tamura, N ^a   Valek, B C ^a   Tu, K N ^b  

^a LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COPPER; COPPER ALLOYS; DIFFRACTION; ELECTROMIGRATION; GRAIN (AGRICULTURAL PRODUCT); METALLIZING; PARTICLE ACCELERATORS; PLASTICS; SYNCHROTRONS; X RAY DIFFRACTION;

AMERICAN INSTITUTE OF PHYSICS (AIP); CURRENT FLOWING; ELECTROMIGRATION (EM); GEOMETRICALLY NECESSARY DISLOCATIONS (GNDS); GRAIN ROTATIONS; INDIVIDUAL (PSS 544-7); PEAK POSITIONS; POLYCHROMATIC X-RAY MICRODIFFRACTION (PXM); WHITE BEAMS; X RAY MICRO DIFFRACTION;

AGRICULTURAL PRODUCTS;

EID: 47749140040     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2952073     Document Type: Article

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