Finite element analysis of thermal stress in Through-Silicon Via structure

2012 7th International Conference on Electrical and Computer Engineering, ICECE 2012

Volumn , Issue , 2012, Pages 62-65

  Sultana, Tanzia ^a   Alam, Md Nafiul ^a   Hossain, Md Faruque ^a  

^a KHULNA UNIVERSITY OF ENGINEERING AND TECHNOLOGY   (Bangladesh)

Author keywords

Carbon nanotube; Finite element method; Thermal stress; Through silicon via

Indexed keywords

CARBON NANOTUBES (CNT); CONSTITUENT MATERIALS; ELECTRONIC PACKAGING; KEY TECHNOLOGIES; THERMO-MECHANICAL PERFORMANCE; THERMO-MECHANICAL STRESS; THERMOMECHANICAL RELIABILITY; THROUGH-SILICON VIA;

CARBON NANOTUBES; ELECTRONICS PACKAGING; FILLERS; FINITE ELEMENT METHOD; MATERIALS PROPERTIES; STRESS CONCENTRATION;

THERMAL STRESS;

EID: 84875546355     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICECE.2012.6471485     Document Type: Conference Paper

References (10)

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