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Advanced Materials

Volumn 22, Issue 44, 2010, Pages 5039-5042

Ultrafast transfer of metal-enhanced carbon nanotubes at low temperature for large-scale electronics assembly

(5) Fu, Yifeng a,b Qin, Yiheng a,c Wang, Teng a Chen, Si a,d Liu, Johan a,d

a CHALMERS UNIVERSITY OF TECHNOLOGY (Sweden)

b FOAB Elektronik AB (Sweden)

c SHT SMART HIGH TECH AB (Sweden)

d SHANGHAI UNIVERSITY (China)

Author keywords

carbon nanotubes; electronics assembly; metal enhanced CNTs; ultrafast CNT transfer

Indexed keywords

ELECTRICAL PERFORMANCE; ELECTRONICS ASSEMBLY; LOW TEMPERATURES; METAL-COATED; ORDER OF MAGNITUDE; SHEAR TESTS; TRANSFER METHOD; TRANSFER PROCESS; ULTRA-FAST; YIELD RATES;

METALS;

CARBON NANOTUBES;

CARBON NANOTUBE; INDIUM; METAL;

ARTICLE; CHEMISTRY; COLD; ELECTRICITY; ELECTRONICS; INSTRUMENTATION; SHEAR STRENGTH; ULTRASTRUCTURE;

COLD TEMPERATURE; ELECTRICITY; ELECTRONICS; INDIUM; METALS; NANOTUBES, CARBON; SHEAR STRENGTH;

EID: 78649868699 PISSN: 09359648 EISSN: 15214095 Source Type: Journal
DOI: 10.1002/adma.201002415 Document Type: Article

Times cited : (51)

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