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Journal of Electronic Materials

Volumn 37, Issue 11, 2008, Pages 1691-1697

A paradigm of carbon nanotube interconnects in microelectronic packaging

(6) Sun, Yangyang a,b Zhu, Lingbo a Jiang, Hongjin a,b Lu, Jiongxin a Wang, Wei a Wong, C P a

a Georgia Institute of Technology (United States)

b GEORGIA INSTITUTE OF TECHNOLOGY (United States)

Author keywords

Carbon nanotubes; Interconnect; Ohmic contact; Transfer

Indexed keywords

CARBON NANOTUBE INTERCONNECTS; CNT ARRAYS; CNT FILMS; COPPER SUBSTRATES; ELECTRICAL MEASUREMENTS; ELECTRICAL PROPERTIES; INTERCONNECT; MICRO-ELECTRONIC PACKAGING; OHMIC CONTACT; SN-PB SOLDER; SOLDER PASTES; TRANSFER; TRANSFER PROCESSES;

ADHESION; BRAZING; CHIP SCALE PACKAGES; COPPER; ELECTRIC PROPERTIES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; LEAD; MICROELECTRONICS; NANOCOMPOSITES; NANOPORES; NANOSTRUCTURED MATERIALS; NANOSTRUCTURES; NANOTUBES; OHMIC CONTACTS; SUBSTRATES; TIN; WELDING;

CARBON NANOTUBES;

EID: 53149153131 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0533-1 Document Type: Article

Times cited : (27)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.