Current-assisted direct Cu/Cu joining

Scripta Materialia

Volumn 104, Issue , 2015, Pages 21-24

  Shin, Chanho ^a   Ma, Sung Woo ^a   Lee, Jeong Hwan ^b   Kim, Ki Bum ^b   Suh, Minsuk ^b   Kim, Namseog ^b   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

Author keywords

Cu Cu direct; Electromigration; Joining; Joule heating

Indexed keywords

ELECTROMIGRATION; JOULE HEATING;

CU WIRES; ENHANCED DIFFUSION; FRACTURE LOAD; JOULE HEATING EFFECT;

JOINING;

EID: 84929270395     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2015.03.016     Document Type: Article

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