High throughput Cu-Cu bonding by non-thermo-compression method

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2013, Pages 1158-1164

  Tan, Chuan Seng ^a   Chong, Gang Yih ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICALLY CONDUCTIVE; FOUR-POINT BENDING TEST; HYDROPHILIC SURFACES; MECHANICAL AND ELECTRICAL; POST-BONDING ANNEALING; ROOM TEMPERATURE BONDING; THERMO COMPRESSION BONDING; THERMO-MECHANICAL STRESS;

BATCH DATA PROCESSING; BOND STRENGTH (CHEMICAL); FLIP CHIP DEVICES; PASSIVATION; STRESSES; THROUGHPUT;

WAFER BONDING;

EID: 84883351237     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2013.6575720     Document Type: Conference Paper

References (11)

1. C. S. Tan and R. Reif, Electrochem. Solid-State Lett., vol. 8, no. 6, pp. G147-G149, 2005.
2. K. N. Chen, C. S. Tan, A. Fan, and R. Reif, Electrochem. Solid-State Lett., vol. 7, no. 1, pp. 14-16, Jan. 2004.
3. A. Shigetou, T. Itoh, K. Sawada, and T. Suga, IEEE Trans. Adv. Packag., vol. 31, no. 3, pp. 473-478, Aug. 2008.
4. J. Lannon Jr., C. Gregory, M. Lueck, A. Huffman, and D. Temple, IEEE ECTC 2009, pp. 355-359, May. 2009
5. T. H. Kim, M. M. R. Howlader, T. Itoh and T. Suga, J. Vac. Sci. Technol., vol. 21, pp. 449-453, 2003.
6. E.-J. Jang, S. Hyun, H.-J. Lee, and Y.-B. Park, J. Electronic Materials, vol. 38, pp. 2449-2454, 2009.
7. Lan Peng, Hong Yu Li, Dau Fatt Lim, S. Gao, and Chuan Seng Tan, IEEE Electronic Components and Technology Conference (ECTC), Florida, USA, May 31-June 3, 2011.
8. L. Peng, H. Y. Li, D. F. Lim, S. Gao, and C. S. Tan, IEEE Transactions on Electron Devices, 58(8), pp. 2500-2506, 2011. (10.1109/TED.2011.2156415)
9. C. S. Tan, D. F. Lim, S. G. Singh, S. K. Goulet, and M. Bergkvist, Appl. Phys. Lett., vol. 95, pp. 2108-2110, Nov. 2009.
10. R. Shaviv, S. Toham and P. Woytowitz, Microelectron. Eng., 82, 99 (2005).
11. H. Zhenyu, Z. Suo, X. Guanghai, H. Jun, J. H. Prevost and N. Sukumar, Eng. Fracture Mech., 72, 2584 (2005).